Hsinchu, Taiwan

Jui-Teng Hsu

This inventor holds 1 USPTO granted patent. Top assignee: Iteq Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jui-Teng Hsu. Retrieved from https://idiyas.com/inventor/jui-teng-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jui-Teng Hsu and His Toughened Resin Composition.

Introduction

Jui-Teng Hsu is an inventor associated with Hsinchu, Taiwan, and Iteq Corporation. His work includes a patent for a toughened resin composition designed to combine toughness with strong mechanical properties.

Latest Patents

Hsu is credited with 1 patent, titled “Toughened Resin Composition.” The invention combines a toughened and modified compound, a thermosetting polymer, and a toughening resin. The modified compound includes styrene maleic anhydride, an anhydride-grafted olefin polymer, and a diisocyanate compound. The diisocyanate forms polyimide bonds with both the styrene maleic anhydride compound and the grafted olefin polymer. The composition is described as offering high toughness and excellent mechanical properties, with potential applications in electronics, aerospace, and related fields.

Career Highlights

Hsu’s patent reflects work on resin materials intended to improve durability and mechanical performance. His association with Iteq Corporation connects this invention to the company’s work in advanced materials.

Collaborations

Hsu’s listed coworkers include Sheng-yen Wu and PO-Hsun Lee. Their shared professional context provides a connection among inventors working in the same company environment.

Conclusion

Jui-Teng Hsu’s patented resin composition brings together multiple polymer components to target toughness and mechanical strength, with potential uses across electronics, aerospace, and other industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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