Hsinchu County, Taiwan

Wen-Pin Su

This inventor holds 1 USPTO granted patent. Top assignee: Iteq Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Pin Su. Retrieved from https://idiyas.com/inventor/wen-pin-su-w8px9suo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Wen-Pin Su and Toughened Resin Innovation.

Introduction

Wen-Pin Su is an inventor associated with Hsinchu County, Taiwan, and Iteq Corporation. Her work includes a patent for a toughened resin composition designed to combine toughness with strong mechanical properties.

Latest Patents

Su is named on 1 patent: “Toughened Resin Composition.” The invention combines a toughened and modified compound, a thermosetting polymer, and a toughening resin. In the modified compound, a diisocyanate forms polyimide bonds with both a styrene maleic anhydride compound and an anhydride-grafted olefin polymer. The disclosure describes the composition as having high toughness and excellent mechanical properties, with potential applications in electronics, aerospace, and related fields.

Career Highlights

Su’s patent reflects work on resin materials intended to improve toughness and mechanical performance. Her association with Iteq Corporation connects her inventive work with a company active in materials and technology.

Collaborations

The provided information lists Sheng-yen Wu and PO-Hsun Lee as Su’s coworkers. It does not specify whether they collaborated with her on this patent.

Conclusion

Wen-Pin Su’s patented resin composition brings together several polymer components to target durable, high-performance materials for applications including electronics and aerospace.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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