Hsinchu, Taiwan

Chun-Han Lin

This inventor holds 1 USPTO granted patent. Top assignee: Iteq Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Han Lin. Retrieved from https://idiyas.com/inventor/chun-han-lin-1he1a7r4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chun-Han Lin: Inventor of a Toughened Resin Composition.

Introduction

Chun-Han Lin is an inventor based in Hsinchu, Taiwan, and is associated with Iteq Corporation. His patent work includes a resin formulation designed to combine toughness with strong mechanical properties.

Latest Patents

Lin is named on 1 patent, titled “Toughened Resin Composition.” The invention describes a composition containing a toughened and modified compound, a thermosetting polymer, and a toughening resin. The modified compound combines a styrene maleic anhydride compound, an anhydride-grafted olefin polymer, and a diisocyanate compound. The diisocyanate forms polyimide bonds with both the styrene maleic anhydride compound and the anhydride-grafted olefin polymer. The disclosure presents the composition as a material with high toughness and excellent mechanical properties, with potential applications in electronics, aerospace, and related fields.

Career Highlights

Lin’s listed patent reflects work on polymer materials and resin composition design. His association with Iteq Corporation connects his inventive work with a company active in advanced materials.

Collaborations

The provided information lists Sheng-yen Wu and PO-Hsun Lee as Lin’s coworkers. No further details about their roles in the patent or their specific contributions are provided.

Conclusion

Chun-Han Lin’s patent on a toughened resin composition highlights an approach to improving material toughness and mechanical performance for potential use in electronics, aerospace, and other applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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