Hsinchu, Taiwan

Chun-Ming Chiu

This inventor holds 1 USPTO granted patent. Top assignee: Iteq Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Ming Chiu. Retrieved from https://idiyas.com/inventor/chun-ming-chiu-sus56oyh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chun-Ming Chiu: Inventor of a Toughened Resin Composition.

Introduction

Chun-Ming Chiu is an inventor associated with Hsinchu, Taiwan, and Iteq Corporation. His work includes a patent for a toughened resin composition designed to combine high toughness with strong mechanical properties.

Latest Patents

Chiu is associated with 1 patent, titled “Toughened Resin Composition.” The invention describes a composition containing a toughened and modified compound, a thermosetting polymer, and a toughening resin. The modified compound combines styrene maleic anhydride, an anhydride-grafted olefin polymer, and a diisocyanate compound. The diisocyanate forms polyimide bonds with both the styrene maleic anhydride compound and the grafted olefin polymer. The disclosure identifies potential applications in electronics, aerospace, and related fields.

Career Highlights

Chiu’s listed patent work focuses on improving resin toughness and mechanical performance. The composition’s combination of modified compounds and thermosetting materials is intended to support demanding applications.

Collaborations

Chiu is associated with Iteq Corporation. His listed coworkers include Sheng-yen Wu and PO-Hsun Lee.

Conclusion

Chun-Ming Chiu’s patent describes a resin composition developed to deliver enhanced toughness and mechanical properties, with potential uses across electronics, aerospace, and other industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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