The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Mar. 18, 2021
Applicant:
Iteq Corporation, Hsinchu County, TW;
Inventors:
Yen-Hsing Wu, Hsinchu County, TW;
Chen-Hao Chang, Hsinchu County, TW;
Assignee:
ITEQ CORPORATION, Hsinchu County, TW;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01);
Abstract
A resin composition, a prepreg, and a printed circuit board are provided. The resin composition is used to form a dielectric substrate layer. The resin composition includes a polymeric based material and fillers. Based on a total volume of the resin composition being 100 vol %, the resin composition includes 10 vol % to 60 vol % of the polymeric based material and 1 vol % to 80 vol % of the fillers. The fillers include hollow fillers, and the hollow fillers include a first hollow filler. A material of the first hollow filler is silicon dioxide.