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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10696783 B1

PDFFull Text
Date of Patent:
Jun. 30, 2020

Filed:

Dec. 28, 2017

Resin composition, prepreg, and copper clad laminate

Applicants:

Iteq Corporation, Xinpu Township, Hsinchu County, TW;

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chen-Hsi Cheng, Xinpu Township, TW;

Ming-Hung Huang, Xinpu Township, TW;

Assignees:

ITEQ CORPORATION, Xinpu Township, Shinchu County, TW;

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B32B 15/092 (2006.01); B32B 15/082 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08L 71/12 (2006.01); C08K 9/02 (2006.01); C08G 61/10 (2006.01); C08J 5/24 (2006.01); C08K 3/013 (2018.01); C08K 3/04 (2006.01); C08K 3/14 (2006.01); C08K 3/28 (2006.01); C08K 3/34 (2006.01); C08K 5/17 (2006.01); C08K 5/3492 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C08G 65/48 (2006.01); C09D 4/00 (2006.01); C08F 283/08 (2006.01); C08L 29/10 (2006.01); C08K 3/22 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08G 61/10 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C08F 283/085 (2013.01); C08G 65/485 (2013.01); C08J 5/24 (2013.01); C08K 3/013 (2018.01); C08K 3/04 (2013.01); C08K 3/14 (2013.01); C08K 3/28 (2013.01); C08K 3/34 (2013.01); C08K 5/17 (2013.01); C08K 5/34924 (2013.01); C08L 29/10 (2013.01); C08L 63/00 (2013.01); C08L 71/12 (2013.01); C09D 4/00 (2013.01); C08G 2261/1642 (2013.01); C08G 2261/1644 (2013.01); C08G 2650/22 (2013.01); C08J 2329/10 (2013.01); C08J 2471/12 (2013.01); C08K 2003/2227 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.

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