The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

May. 03, 2018
Applicant:

Iteq Corporation, Hsinchu County, TW;

Inventors:

Ta-Yuan Yu, Hsinchu County, TW;

Kai-Yang Chen, Hsinchu County, TW;

Yen-Hsing Wu, Hsinchu County, TW;

Assignee:

ITEQ CORPORATION, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/26 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
B32B 5/26 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); H05K 1/0366 (2013.01); B32B 2250/05 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); H05K 2201/012 (2013.01);
Abstract

A laminated substrate including a halogen-free epoxy resin composition. The halogen-free epoxy resin composition includes 100 parts by weight of a halogen-free naphthalene type epoxy resin, 10 to 25 parts by weight of a DOPO modified curing agent, 25 to 45 parts by weight of a cyanate resin, 35 to 60 parts by weight of bismaleimide, 45 to 65 parts by weight of a non-DOPO flame retardant, and 0.5 to 15 parts by weight of a curing accelerator. The laminated substrate of the present disclosure includes a halogen-free epoxy resin composition which has the characteristic of high transition temperature, so that the halogen-free epoxy resin composition has low dielectric constant, low dissipation factor, high heat resistance and high storage modulus.


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