The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Dec. 28, 2017
Applicants:

Industrial Technology Research Institute, Hsinchu, TW;

Iteq Corporation, Xinpu Township, Hsinchu County, TW;

Inventors:

Feng-Po Tseng, Taoyuan, TW;

Wen-Pin Ting, Kaohsiung, TW;

Kuo-Chan Chiou, Tainan, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08G 61/10 (2006.01); C08K 5/25 (2006.01); C08K 5/14 (2006.01); C08K 5/17 (2006.01); C08K 5/23 (2006.01); B32B 33/00 (2006.01); C08F 212/34 (2006.01); C09D 4/00 (2006.01); C08F 220/20 (2006.01); C08L 29/10 (2006.01); C08K 5/00 (2006.01); C08K 5/5415 (2006.01); H05K 1/05 (2006.01); C08K 5/3492 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B32B 33/00 (2013.01); C08F 212/34 (2013.01); C08F 220/20 (2013.01); C08G 61/10 (2013.01); C08K 5/0025 (2013.01); C08K 5/14 (2013.01); C08K 5/17 (2013.01); C08K 5/23 (2013.01); C08K 5/3492 (2013.01); C08K 5/5415 (2013.01); C08L 29/10 (2013.01); C09D 4/00 (2013.01); H05K 1/056 (2013.01); B32B 2260/044 (2013.01); B32B 2307/302 (2013.01); B32B 2311/12 (2013.01); C08J 2347/00 (2013.01);
Abstract

A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which Ris —CH—, —C(═O)—, or —(CH)—(CH)—, and Ris H or CH.


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