The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
May. 08, 2023
Applicant:
Iteq Corporation, Hsinchu County, TW;
Inventors:
Sheng-Yen Wu, Hsinchu County, TW;
Shou-Neng To, Hsinchu County, TW;
Ya-Ping Liu, Hsinchu County, TW;
Chen-Hao Chang, Hsinchu County, TW;
Pei-Chun Lai, Hsinchu County, TW;
Assignee:
ITEQ CORPORATION, Hsinchu County, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); H05K 1/0346 (2013.01); H05K 1/056 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract
A resin composition and a metal clad substrate are provided. The resin composition includes: 5 phr to 15 phr of a maleimide resin, 5 phr to 30 phr of a benzoxazine resin, 40 phr to 70 phr of an epoxy resin, and 40 phr to 60 phr of fillers. An amount of fluorine atoms contained in the maleimide resin ranges from 10 wt % to 50 wt %.
Wu, Sheng-Yen. (2026). Resin composition and metal clad substrate (U.S. Patent No. 12565582). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12565582
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile