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Inktec Co., Inc.

USPTO Granted Patents = 61

% Expired Patents = 49.2

EPO Patents = 19

Trademarks = 2

Forward Citations = 220

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92 inventors (with patents filed for the assignee):

Kwang-Choon Chung (36 out of 37 patents)

Kwang Choon Chung (24 out of 29 patents)

Ji Hoon Yoo (21 out of 21 patents)

4. Hyun-Nam Cho (18 out of 19 patents)

5. Hyun Nam Cho (14 out of 17 patents)

6. Young-Kwan Seo (10 out of 10 patents)

7. Seong-Yong Uhm (8 out of 12 patents)

8. Nam-Boo Cho (7 out of 7 patents)

9. Byung Woong Moon (6 out of 6 patents)

10. Myoung-Seon Gong (6 out of 7 patents)

11. Su Han Kim (6 out of 13 patents)

12. Yi-Sup Han (5 out of 5 patents)

13. Jeong-Bin Park (5 out of 5 patents)

14. Dong-Hun Nam (5 out of 5 patents)

15. Joonki Seong (5 out of 5 patents)

Core Competencies:

Printed Circuit Board

Etching Solutions

Conductive Inks

Flexible Printed Circuit Board

Transparent Conductive Film

Organic Light-Emitting Devices

Electromagnetic Interference Shielding

Silver Ink Composition

Conductive Transparent Substrate

Metal Clad Laminates

Optoelectronic Devices

Ink Jet Printer

61 patents: Sort by Forward Citations

1. 11453823 - Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite (2022-09-27),

2. 11317514 - Method for forming circuits using seed layer and etchant composition for selective etching of seed layer (2022-04-26),

3. 11160171 - Circuit forming method using selective etching of electrically conductive metal this film seed layer and etching solution composition (2021-10-26),

4. 11089691 - Microcircuit forming method and etching fluid composition (2021-08-10),

5. 10887997 - Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCB (2021-01-05),

6. 10696858 - Ink composition for steel material, having excellent adhesion, method for manufacturing printed steel sheet by using same, and printed steel sheet manufactured thereby (2020-06-30),

7. 10383212 - Printed circuit board having EMI shielding function, method for manufacturing the same, and flat cable using the same (2019-08-13),

8. 10178773 - Method for manufacturing a metal printed circuit board (2019-01-08),

9. 10080299 - Manufacturing method of double sided printed circuit board (2018-09-18),

10. 9914743 - Organic silver complexes, their preparation methods and their methods for forming thin layers (2018-03-13),

11. 9839138 - Method for fabricating blackened conductive patterns (2017-12-05),

12. 9832882 - Method for making conductive pattern and conductive pattern (2017-11-28),

13. 9832881 - Method of manufacturing transparent electrode film for display and transparent electrode film for display (2017-11-28),

14. 9831487 - Method for manufacturing transparent electrode film (2017-11-28),

15. 9788418 - Conductive transparent substrate manufacturing method, and conductive transparent substrate (2017-10-10),

Inktec Co., Inc. is a South Korean company specializing in advanced technologies for printed circuit boards (PCBs). The organization focuses on the development and manufacturing of innovative solutions, including etching solutions, conductive inks, and flexible printed circuit boards. Inktec also explores applications in transparent conductive films, organic light-emitting devices, and electromagnetic interference shielding, positioning itself as a key player in the electronics industry with a commitment to enhancing PCB technology.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

61 Patents

#7 in

#278 in South Korea

#11,907 in the World

Inktec Co., Inc.

Forward Citations = 220

92 inventors:

Kwang-Choon Chung (36 out of 37 patents)

Kwang Choon Chung (24 out of 29 patents)

Ji Hoon Yoo (21 out of 21 patents)

4. Hyun-Nam Cho (18 out of 19 patents)

5. Hyun Nam Cho (14 out of 17 patents)

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