The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Dec. 24, 2012
Applicant:
Inktec Co., Ltd., Ansan-si, KR;
Inventors:
Kwang-Choon Chung, Yongin-si, KR;
Nam Boo Cho, Anyang-si, KR;
Young-Koo Han, Bucheon-si, KR;
Myung Bong Yoo, Yongin-si, KR;
Woong Ku On, Siheung-si, KR;
Assignee:
INKTEC CO., LTD., Ansan-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H05K 3/0014 (2013.01); H05K 3/0061 (2013.01); H05K 3/207 (2013.01); H05K 2201/0376 (2013.01); Y10T 29/49155 (2015.01);
Abstract
Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.