Yongin, South Korea

Myung Bong Yoo

This inventor holds 3 USPTO granted patents and 1 EPO patent. Top assignee: Inktec Co., Inc.. Active years: 2012-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Myung Bong Yoo. Retrieved from https://idiyas.com/inventor/myung-bong-yoo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 66.7

 

Average Co-Inventor Count = 5.9

ph-index = 1

Forward Citations = 25(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2012)
  • Yongin-si, KR (2015 - 2019)

Company Filing History:


Years Active: 2012-2019

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3 patents (USPTO):Explore Patents

Title: Myung Bong Yoo: Innovating in Metal and EMI Shielding Technologies

Introduction

Myung Bong Yoo, a prominent inventor located in Yongin-si, South Korea, is recognized for his contributions to advanced manufacturing techniques through innovative patent solutions. With a total of three patents to his name, Yoo has demonstrated exceptional ingenuity in the fields of metal printed circuit boards and electromagnetic interference shielding films.

Latest Patents

Yoo's latest patents highlight significant advancements in technology. The first patent details a method for manufacturing a metal printed circuit board. This method involves a series of steps, including printing a circuit pattern on a release film, applying a heat conductive insulating layer, laminating a heat conductive base layer, and finally removing the release film. This innovative approach enhances the efficiency and reliability of printed circuit boards.

His second notable patent focuses on a method for manufacturing an electromagnetic interference (EMI) shielding film. The process includes several key steps: providing a single insulating layer on a first protective film, applying a metal layer on the insulating layer, adding a conductive adhesive layer, and finally, placing a second protective film over the conductive adhesive. This complex layering not only addresses EMI challenges but also incorporates flame-retardant and abrasion-resistant materials for enhanced durability.

Career Highlights

Myung Bong Yoo's career is marked by his association with Inktec Co., Inc., where he has leveraged his expertise in innovative material applications. His work not only reflects his individual creativity but also contributes to the company's overarching goal of advancing technology in printed circuits and electronic shielding solutions.

Collaborations

Throughout his career, Yoo has collaborated with esteemed colleagues, including Kwang-Choon Chung and Nam Boo Cho. Their collective insights and expertise have fostered an environment of innovation, enabling them to explore and develop groundbreaking technologies that address contemporary challenges in electronic manufacturing.

Conclusion

As an accomplished inventor, Myung Bong Yoo continues to push the boundaries of what is possible in the realms of metal printed circuit boards and EMI shielding films. His innovative patents and contributions to Inktec Co., Inc. illustrate the impactful role inventors play in shaping the future of technology through relentless creativity and collaboration.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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