Inktec Co., Inc.

Myung Bong Yoo

Kwang-Choon Chung

Nam Boo Cho

Kwang Choon Chung

Hyun-Nam Cho

Byung Hun Kim

Hyun Nam Cho

Su Han Kim

Nam-Boo Cho

Young-Koo Han

Yi Sup Han

Seok Pil Jin

Woong Ku On

Seong Hoon No

Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.

Method for manufacturing a metal printed circuit board

Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.

Method for manufacturing electromagnetic interference shielding film

The present invention relates to a process for preparation of silver nanoparticles and the compositions of silver ink containing the same. The present invention can prepare the silver nanoparticles with various shapes through a simple preparation process, improve the selectivity of the size of the silver nanoparticles, fire the silver nanoparticles even at a low temperature of 150&#xb0; C. or less during a short time, provide the ink compositions capable of forming the coating or the fine pattern showing the high conductivity, and provide the ink compositions capable of being applied to the reflective film material, the electromagnetic wave shield, and the antimicrobial agent, etc.

Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same

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Yongin-si, South Korea

Myung Bong Yoo