The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Nov. 12, 2010
Kwang Choon Chung, Yongin-si, KR;
Hyun Nam Cho, Gunpo-si, KR;
Myung Bong Yoo, Yongin-si, KR;
Nam-boo Cho, Anyang-si, KR;
Seok Pil Jin, Pyeongtaek-si, KR;
Seong Hoon NO, Pyeongtaek-si, KR;
Kwang Choon Chung, Yongin-si, KR;
Hyun Nam Cho, Gunpo-si, KR;
Myung Bong Yoo, Yongin-si, KR;
Nam-Boo Cho, Anyang-si, KR;
Seok Pil Jin, Pyeongtaek-si, KR;
Seong Hoon No, Pyeongtaek-si, KR;
Inktec Co., Ltd., Ansan-si, Kyeongki-do, KR;
Abstract
Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.