The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Jan. 04, 2013
Inktec Co., Ltd., Gyeonggi-do, KR;
Kwang-Choon Chung, Gyeonggi-do, KR;
Young-Koo Han, Gyeonggi-do, KR;
Myung-Bong Yoo, Gyeonggi-do, KR;
Kwang-Baek Yoon, Gyeonggi-do, KR;
Bong-Ki Jung, Gyeonggi-do, KR;
INKTEC CO., LTD., Ansan-si, Gyeonggi-Do, TW;
Abstract
Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.