The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Feb. 20, 2018
Applicant:

Inktec Co., Ltd., Ansan-si, KR;

Inventors:

Kwang-Choon Chung, Yongin-si, KR;

Byung Woong Moon, Siheung-si, KR;

Su Han Kim, Ansan-si, KR;

Jae Rin Kim, Yongin-si, KR;

Assignee:

InkTee Co., Ltd., Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C23F 1/00 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); H05K 1/09 (2006.01); H05K 3/06 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); C25D 5/10 (2006.01);
U.S. Cl.
CPC ...
C09K 13/00 (2013.01); C23F 1/00 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01); C25D 5/10 (2013.01); H05K 1/09 (2013.01); H05K 3/067 (2013.01); H05K 3/423 (2013.01); H05K 3/425 (2013.01); H05K 3/429 (2013.01); H05K 3/4652 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0793 (2013.01); H05K 2203/0796 (2013.01);
Abstract

The disclosure relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier member and the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.


Find Patent Forward Citations

Loading…