The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Feb. 09, 2018
Applicant:
Inktec Co., Ltd., Ansan-si, KR;
Inventors:
Kwang-Choon Chung, Yongin-si, KR;
Byung Woong Moon, Siheung-si, KR;
Su Han Kim, Ansan-si, KR;
Jung Yoon Moon, Ansan-si, KR;
Hyeon-Jun Seong, Ansan-si, KR;
Jae Rin Kim, Yongin-si, KR;
Assignee:
InkTec Co., Ltd., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/06 (2006.01); C09K 13/00 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/18 (2006.01); H05K 3/28 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/067 (2013.01); C09K 13/00 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/188 (2013.01); H05K 3/285 (2013.01); H05K 3/424 (2013.01); H05K 3/425 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0796 (2013.01);
Abstract
The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.