The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Jul. 02, 2018
Applicant:

Inktec Co., Ltd., Ansan-si, Gyeonggi-do, KR;

Inventors:

Kwang-Choon Chung, Yongin-si, KR;

Byung Woong Moon, Siheung-si, KR;

Assignee:

INKTEC CO., LTD., Ansan-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); H01R 12/79 (2011.01); H05K 1/11 (2006.01); H01B 7/08 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H01B 7/08 (2013.01); H05K 1/028 (2013.01); H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 3/422 (2013.01); H05K 3/425 (2013.01); H05K 9/0098 (2013.01); H01R 12/79 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09681 (2013.01); H05K 2203/072 (2013.01);
Abstract

The present disclosure relates a printed circuit board having an EMI shielding function. In an example embodiment, the printed circuit board includes a substrate, a signal unit disposed on the substrate, a ground unit disposed in parallel with the signal unit, an insulation layer disposed above the substrate and covering the signal unit and the ground unit, an EMI shielding layer disposed on the insulation layer and under the substrate, respectively, and a shielding bridge passing through the substrate and the insulation layer at opposite sides of the signal unit and electrically connecting the EMI shielding layer disposed on the insulation layer to the EMI shielding layer disposed under the substrate.


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