For the Inventor, By the Inventor

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Phoenix, AZ, United States of America

Hvvi Semiconductors, Inc.

USPTO Granted Patents = 28

% Expired Patents = 10.7

Forward Citations = 112

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8 inventors (with patents filed for the assignee):

Robert Bruce Davies (11 out of 119 patents)

Bishnu Prasanna Gogoi (10 out of 62 patents)

Michael Albert Tischler (7 out of 165 patents)

4. Jeanne S Pavio (2 out of 5 patents)

5. Daniel D Moline (1 out of 1 patent)

6. David William Wolfert, Jr (1 out of 1 patent)

7. Dan Moline (1 out of 1 patent)

8. Warren L Seely (1 out of 27 patents)

Core Competencies:

Transistor Structure

Semiconductor Device

Dielectric Platform

RF Power Transistor

Silicon-Germanium-Carbon

Trench Drain

Bidirectional Device

Electrical Stress Protection

Conductive Layer

Sacrificial Pillar

Cavities Isolation

Dual Shield Layers

28 patents: Sort by Forward Citations

1. 8216925 - Transistor structure having a trench drain (2012-07-10),

2. 8133794 - Semiconductor structure and method of manufacture (2012-03-13),

3. 8133783 - Semiconductor device having different structures formed simultaneously (2012-03-13),

4. 8125044 - Semiconductor structure having a unidirectional and a bidirectional device and method of manufacture (2012-02-28),

5. 8076724 - Transistor structure having an active region and a dielectric platform region (2011-12-13),

6. 8067834 - Semiconductor component (2011-11-29),

7. 8063467 - Semiconductor structure and method of manufacture (2011-11-22),

8. 8049297 - Semiconductor structure (2011-11-01),

9. 8049261 - Semiconductor structure and method of manufacture (2011-11-01),

10. 8048760 - Semiconductor structure and method of manufacture (2011-11-01),

11. 8022485 - Transistor structure having reduced input capacitance (2011-09-20),

12. 8008720 - Transistor structure having a conductive layer formed contiguous in a single deposition (2011-08-30),

13. 8008719 - Transistor structure having dual shield layers (2011-08-30),

14. 7999250 - Silicon-germanium-carbon semiconductor structure (2011-08-16),

15. 7998829 - Semiconductor structure and method of manufacture (2011-08-16),

Company Overview

Hvvi Semiconductors, Inc. is a technology company based in Phoenix, Arizona, specializing in the development and manufacturing of advanced semiconductor solutions. The company focuses on innovative materials and processes that enhance the performance and efficiency of electronic devices. With a commitment to research and development, Hvvi aims to push the boundaries of semiconductor technology, catering to various industries including consumer electronics, automotive, and telecommunications, thereby contributing to the evolution of modern electronics.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

28 Patents

#31 in Phoenix, AZ

#149 in Arizona

#12,013 in US

#23,285 in the World

Phoenix, AZ, United States of America

Hvvi Semiconductors, Inc.

Forward Citations = 112

8 inventors:

Robert Bruce Davies (11 out of 119 patents)

Bishnu Prasanna Gogoi (10 out of 62 patents)

Michael Albert Tischler (7 out of 165 patents)

4. Jeanne S Pavio (2 out of 5 patents)

5. Daniel D Moline (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hvvi Semiconductors, Inc.. Retrieved from https://idiyas.com/company/hvvi-semiconductors

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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