The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Aug. 21, 2007
Daniel D. Moline, Gilbert, AZ (US);
Daniel D. Moline, Gilbert, AZ (US);
HVVi Semiconductors, Inc., Phoenix, AZ (US);
Abstract
In various embodiments, semiconductor components and methods to manufacture these components are disclosed. In one embodiment, a method to manufacture a semiconductor component is disclosed. The semiconductor includes a heat sink and a semiconductor die that has a first terminal on a top surface of the semiconductor die, a second terminal on the top surface of the die, and a third terminal on the bottom surface of the die. The method includes attaching a first portion of a leadframe structure to the first terminal of the semiconductor die. The method further includes attaching the second terminal of the semiconductor die to the heat sink after the attaching of the first portion of the leadframe structure to the first terminal of the semiconductor die, wherein the leadframe structure is spaced apart from the heat sink and is electrically isolated from the heat sink. Other embodiments are described and claimed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile