For the Inventor, By the Inventor

Enter assignee name

Furukawa Circuit Foil Co., Ltd.

USPTO Granted Patents = 15

Forward Citations = 101

Loading Chart...

Loading Chart...

17 inventors (with patents filed for the assignee):

Hiroshi Nakatsugawa (7 out of 7 patents)

Yuuji Suzuki (3 out of 15 patents)

Hisao Kimijima (3 out of 3 patents)

4. Akira Matsuda (2 out of 21 patents)

5. Hideo Otsuka (2 out of 3 patents)

6. Yasuhisa Yoshihara (2 out of 2 patents)

7. Akitoshi Suzuki (1 out of 44 patents)

8. Sadao Matsumoto (1 out of 3 patents)

9. Yuuki Kikuchi (1 out of 3 patents)

10. Tadao Nakaoka (1 out of 1 patent)

11. Kensaku Shinozaki (1 out of 1 patent)

12. Tsukasa Akutsu (1 out of 2 patents)

13. Toshio Tani (1 out of 1 patent)

14. Osamu Kamiyama (1 out of 1 patent)

15. Noborn Matsuki (1 out of 1 patent)

15 patents: Sort by Forward Citations

1. 7476449 - Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield (2009-01-13),

2. 7381475 - Treated copper foil and circuit board (2008-06-03),

3. 7223481 - Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board (2007-05-29),

4. 7215235 - Conductive substrate with resistance layer, resistance board, and resistance circuit board (2007-05-08),

5. 7172818 - Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board (2007-02-06),

6. 7052779 - Copper foil for fine pattern printed circuits and method of production of same (2006-05-30),

7. 6939622 - Chip-on-film use copper foil (2005-09-06),

8. 5135631 - Electrodeposition drum (1992-08-04),

9. 4976826 - Method of making electrodeposited copper foil (1990-12-11),

10. 4964965 - Insoluble electrode device for treatment of metallic material (1990-10-23),

11. 4935310 - Copper foil for a printed circuit and a method for the production thereof (1990-06-19),

12. 4778571 - Method of making electrolytic metal foil and apparatus used therefor (1988-10-18),

13. 4483906 - Copper foil for a printed circuit and a method for the production thereof (1984-11-20),

14. 4386139 - Copper foil for a printed circuit and a method for the production thereof (1983-05-31),

15. 4376154 - Copper foil for a printed circuit and a method for the production thereof (1983-03-08),

Furukawa Circuit Foil Co., Ltd. is a leading manufacturer of flexible printed circuits (FPC) and related products. With a focus on quality, innovation, and customer satisfaction, the company serves a wide range of industries including automotive, telecommunications, and medical devices. With over 50 years of experience, Furukawa Circuit Foil Co., Ltd. is a trusted partner for companies looking for reliable and high-quality circuit solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

15 Patents

#1,345 in Tokyo

#3,363 in Japan

#38,669 in the World

Furukawa Circuit Foil Co., Ltd.

Forward Citations = 101

17 inventors:

Hiroshi Nakatsugawa (7 out of 7 patents)

Yuuji Suzuki (3 out of 15 patents)

Hisao Kimijima (3 out of 3 patents)

4. Akira Matsuda (2 out of 21 patents)

5. Hideo Otsuka (2 out of 3 patents)

Please report any incorrect information to support@idiyas.com

Loading…