The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 1983
Filed:
Oct. 22, 1980
Applicant:
Inventor:
Hiroshi Nakatsugawa, Yokohama, JP;
Assignee:
Furukawa Circuit Foil Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ;
U.S. Cl.
CPC ...
428607 ; 428647 ; 428646 ; 428674 ; 428658 ; 204 / ; 204 / ;
Abstract
A copper foil for a printed circuit comprising a copper layer having the bonding surface coated with a tin layer and having said tin layer coated with a vanadium-containing zinc layer which optionally may be given a chromic acid treatment. The invention also provides a method for producing said copper foil.
Nakatsugawa, Hiroshi. (1983). Copper foil for a printed circuit and a method for the production thereof (U.S. Patent No. 4376154). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4376154
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile