Tadao Nakaoka

Title: Tadao Nakaoka: Innovator in Copper Foil Technology

Introduction

Tadao Nakaoka is a notable inventor based in Tochigi, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper foil technologies. His innovative work has led to advancements in various electronic applications.

Latest Patents

Nakaoka holds a patent for a copper foil designed for chip-on-film use, plasma display panels, and high-frequency printed circuit boards. This patent describes a method of rolling copper foil to achieve a smooth surface area that is not more than 1.30 times that of an ideal smooth surface. The smoothed copper foil is enhanced with fine roughening particles of copper or alloy particles of copper and molybdenum, as well as alloy particles comprising copper and at least one element selected from nickel, cobalt, iron, and chromium. Additionally, it may include a mixture of these alloy particles and oxides of elements such as vanadium, molybdenum, and tungsten.

Career Highlights

Nakaoka is currently employed at Furukawa Circuit Foil Co., Ltd., where he continues to innovate in the field of copper foil technology. His work has been instrumental in improving the performance and reliability of electronic components.

Collaborations

Throughout his career, Nakaoka has collaborated with esteemed colleagues, including Akitoshi Suzuki and Hideo Otsuka. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their respective fields.

Conclusion

Tadao Nakaoka's contributions to copper foil technology exemplify the impact of innovation in the electronics industry. His patent and ongoing work at Furukawa Circuit Foil Co., Ltd. highlight his commitment to advancing material science.