The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2007
Filed:
Aug. 29, 2003
Tadao Nakaoka, Tochigi, JP;
Akitoshi Suzuki, Tochigi, JP;
Hideo Otsuka, Tochigi, JP;
Hisao Kimijima, Tochigi, JP;
Tadao Nakaoka, Tochigi, JP;
Akitoshi Suzuki, Tochigi, JP;
Hideo Otsuka, Tochigi, JP;
Hisao Kimijima, Tochigi, JP;
Furukawa Circuit Foil Co., Ltd., Nikkou, JP;
Abstract
A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having deposited on it fine roughening particles of Cu or alloy particles of Cu and Mo or alloy particles comprising Cu and at least one element selected among a group of Ni, Co, Fe, and Cr or a mixture of this alloy particles and oxide of at least one element selected among a group of V, Mo, and W.