The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 1983
Filed:
Oct. 31, 1980
Applicant:
Inventor:
Hiroshi Nakatsugawa, Yokohama, JP;
Assignee:
Furukawa Circuit Foil Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
428607 ; 428674 ; 204 / ;
Abstract
Copper foil for a printed circuit, which comprises a copper layer and a vanadium-containing zinc layer formed on one side or each side of said copper layer, and a method for producing the copper foil. The bonding surface preferably contains a chromate surface.
Nakatsugawa, Hiroshi. (1983). Copper foil for a printed circuit and a method for the production thereof (U.S. Patent No. 4386139). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4386139
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile