Tochigi-ken, Japan

Sadao Matsumoto



Average Co-Inventor Count = 4.1

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Tochigi, JP (2010)
  • Tochigi-ken, JP (2007 - 2012)

Company Filing History:


Years Active: 2007-2012

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3 patents (USPTO):Explore Patents

Title: Sadao Matsumoto: Innovator in Electrodeposited Copper Foil and Circuit Board Technology

Introduction

Sadao Matsumoto is a notable inventor based in Tochigi-ken, Japan. He has made significant contributions to the field of electrodeposited copper foil and circuit board technology. With a total of 3 patents, his work has had a lasting impact on the industry.

Latest Patents

Matsumoto's latest patents include a surface treated electrodeposited copper foil and a method for preparing a circuit board material. The surface treated electrodeposited copper foil features a smooth M surface, which is treated to achieve specific roughness parameters. The copper foil is produced under precise conditions using a copper sulfate bath. His second patent focuses on a plating bath that forms a resistance layer with a uniform thickness on a conductive base, utilizing essential components such as nickel ions and sulfamic acid.

Career Highlights

Throughout his career, Sadao Matsumoto has worked with prominent companies, including The Furukawa Electric Co., Ltd. and Furukawa Circuit Foil Co., Ltd. His expertise in the field has allowed him to develop innovative solutions that enhance the performance of electronic components.

Collaborations

Matsumoto has collaborated with talented individuals such as Yuuji Suzuki and Akira Matsuda. These partnerships have contributed to the advancement of technology in their respective fields.

Conclusion

Sadao Matsumoto's contributions to electrodeposited copper foil and circuit board technology demonstrate his innovative spirit and dedication to advancing the industry. His patents reflect a commitment to quality and performance in electronic materials.

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