This inventor holds 1 USPTO granted patent. Top assignee: Furukawa Circuit Foil Co., Ltd.. Active years: 1990.
Company Filing History:
Years Active: 1990
Title: The Innovative Contributions of Osamu Kamiyama
Introduction
Osamu Kamiyama is a notable inventor based in Imaichi, Japan. He has made significant contributions to the field of materials science, particularly in the production of electrodeposited copper foil. His innovative methods have implications for various industries, including electronics and manufacturing.
Latest Patents
Kamiyama holds a patent for a method of making electrodeposited copper foil. This method involves carrying out electrolysis by adding a water-soluble cellulose ether to an electrolytic solution. The resulting electrodeposited copper foil exhibits a controllable profile of matte side nodules, which enhances its performance. This innovation allows for the production of copper foil that exceeds IPC specification Class 3 in elongation at both room temperature and high temperatures. He has 1 patent to his name.
Career Highlights
Osamu Kamiyama is associated with Furukawa Circuit Foil Co., Ltd., where he has been instrumental in advancing the company's technological capabilities. His work has not only contributed to the company's success but has also positioned him as a key figure in the field of electrodeposition.
Collaborations
Kamiyama has worked alongside talented colleagues, including Toshio Tani and Noborn Matsuki. Their collaborative efforts have furthered research and development in the area of copper foil production.
Conclusion
Osamu Kamiyama's innovative approach to electrodeposited copper foil production showcases his expertise and commitment to advancing technology. His contributions are valuable to the industry and highlight the importance of innovation in materials science.