The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 1990
Filed:
Feb. 16, 1990
Applicant:
Inventors:
Toshio Tani, Imaichi, JP;
Osamu Kamiyama, Imaichi, JP;
Noborn Matsuki, Imaichi, JP;
Ryosaku Fukuda, Imaichi, JP;
Tsukasa Akutsu, Imaichi, JP;
Hiroshi Nakatsugawa, Imaichi, JP;
Assignee:
Furukawa Circuit Foil Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ;
U.S. Cl.
CPC ...
204 12 ; 204 27 ;
Abstract
Disclosed is a method of making electrodeposited copper foil which comprises carrying electrolysis by adding a water-soluble cellulose ether to an electrolytic solution. A profile of the matte side nodules of the electrodeposited copper foil obtained by the method of the present invention can be easily controlled, and the electrodeposited copper foil which is high above IPC specification Class 3 in elongation at room temperature and high temperature can be obtained.