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Cmk Corporation

USPTO Granted Patents = 17

EPO Patents = 1

Forward Citations = 335

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26 inventors (with patents filed for the assignee):

Hiroyasu Jobetto (9 out of 38 patents)

Yutaka Yoshino (4 out of 4 patents)

Takeshi Wakabayashi (2 out of 41 patents)

4. Ichiro Mihara (2 out of 44 patents)

5. Takahiro Shirai (2 out of 2 patents)

6. Shinji Kadono (2 out of 2 patents)

7. Mineo Kawamoto (2 out of 2 patents)

8. Minoru Enomoto (2 out of 2 patents)

9. Masakatsu Goto (2 out of 2 patents)

10. Makoto Araki (2 out of 2 patents)

11. Naoki Toda (2 out of 2 patents)

12. Toshihiro Kido (2 out of 2 patents)

13. Nobuyuki Kageyama (2 out of 2 patents)

14. Daita Kohno (2 out of 2 patents)

15. Jun Yoshizawa (2 out of 2 patents)

17 patents: Sort by Forward Citations

1. 8035979 - Printed wiring board with built-in semiconductor element, and process for producing the same (2011-10-11),

2. 7910405 - Semiconductor device having adhesion increasing film to prevent peeling (2011-03-22),

3. 7894200 - Printed wiring board with built-in semiconductor element, and process for producing the same (2011-02-22),

4. 7867828 - Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein (2011-01-11),

5. 7709942 - Semiconductor package, including connected upper and lower interconnections (2010-05-04),

6. 7615411 - Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof (2009-11-10),

7. 7608480 - Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion (2009-10-27),

8. 7489032 - Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same (2009-02-10),

9. 7445964 - Semiconductor device and method of manufacturing the same (2008-11-04),

10. 7363706 - Method of manufacturing a multilayer printed wiring board (2008-04-29),

11. 7279750 - Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion (2007-10-09),

12. 7243425 - Printed wiring board and method of manufacturing the same (2007-07-17),

13. 7183639 - Semiconductor device and method of manufacturing the same (2007-02-27),

14. 7087845 - Metal core multilayer printed wiring board (2006-08-08),

15. 5633480 - Printed wiring board having a cover lay laminated on a polyimide resin (1997-05-27),

CMK Corporation is a leading provider of innovative software solutions for businesses. With our cutting-edge technologies and a customer-centric approach, we help organizations streamline their operations, enhance productivity, and achieve growth. Our comprehensive range of products includes enterprise resource planning (ERP) systems, customer relationship management (CRM) software, and supply chain management solutions. Established in 2005, CMK Corporation has built a strong reputation for delivering reliable and scalable software solutions tailored to meet the unique needs of our clients. Visit our website to learn more about how CMK Corporation can transform your business.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

17 Patents

#1,262 in Tokyo

#3,157 in Japan

#34,819 in the World

Cmk Corporation

Forward Citations = 335

26 inventors:

Hiroyasu Jobetto (9 out of 38 patents)

Yutaka Yoshino (4 out of 4 patents)

Takeshi Wakabayashi (2 out of 41 patents)

4. Ichiro Mihara (2 out of 44 patents)

5. Takahiro Shirai (2 out of 2 patents)

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