The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Aug. 12, 2004
Ichiro Mihara, Tachikawa, JP;
Takeshi Wakabayashi, Sayama, JP;
Toshihiro Kido, Ome, JP;
Hiroyasu Jobetto, Hachioji, JP;
Yutaka Yoshino, Isesaki, JP;
Nobuyuki Kageyama, Saitama, JP;
Daita Kohno, Itako, JP;
Jun Yoshizawa, Isesaki, JP;
Ichiro Mihara, Tachikawa, JP;
Takeshi Wakabayashi, Sayama, JP;
Toshihiro Kido, Ome, JP;
Hiroyasu Jobetto, Hachioji, JP;
Yutaka Yoshino, Isesaki, JP;
Nobuyuki Kageyama, Saitama, JP;
Daita Kohno, Itako, JP;
Jun Yoshizawa, Isesaki, JP;
Casio Computer Co., Ltd., Tokyo, JP;
CMK Corporation, Tokyo, JP;
Abstract
A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.