The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Aug. 25, 2005
Eiji Hirata, Isesaki, JP;
Eiji Hirata, Isesaki, JP;
CMK Corporation, Tokyo, JP;
Abstract
The present invention provides a printed wiring board in which there is no positional deviation between a blind via hole and a land and which enables high-density wiring design to be easily achieved. Provided is a method of manufacturing a printed wiring board in which wiring pattern forming layers are connected by a blind via hole, which includes the steps of forming a wiring pattern by etching at least metal foil laminated on a surface of an insulating layer and forming a land having a window portion in a portion where a blind via hole is to be formed; irradiating the window portion with a laser beam having a diameter larger than the diameter of the window portion but smaller than the diameter of the land, thereby making a nonthrough hole for forming the blind via hole; and forming a blind via hole by forming a plating on the nonthrough hole and the land.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile