The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Jan. 28, 2004
Hiroshi Tohkairin, Isesaki, JP;
Kenji Sakakibara, Kariya, JP;
Hideki Kabune, Chiryuu, JP;
CMK Corporation, Tokyo, JP;
Advics Co., Ltd., Kariya, JP;
Abstract
The present invention is characterized in that in a metal-core multilayer printed wiring board () which is obtained by forming one or more of at least inner layers of a laminate having a insulating layer and a conductor layer stacked alternately from a metal plate and has the metal plate as a core, the metal plate () is disposed below a site on which a heating element () is to be mounted, a surface layer over which the heating element () is to be mounted is connected to the metal plate () of the inner layer via a BVH () and a heat radiation layer () is formed over the surface layer. The present invention makes it possible to efficiently radiate heat, which has been released from the heating element, to the outside of the printed wiring board without impairing the packaging density of circuits and at the same time, to mount another element on the side opposite to the side on which the heating element exists.