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Duiven, Netherlands

Besi Netherlands B.v.

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USPTO Granted Patents = 19

EPO Patents = 1

Forward Citations = 6

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17 inventors (with patents filed for the assignee):

Wilhelmus Gerardus Jozef Gal (4 out of 6 patents)

Johannes Lambertus Gerardus Maria Venrooij (4 out of 7 patents)

Jurgen Hendrikus Gerhardus Huisstede (4 out of 4 patents)

4. Henricus Antonius Maria Fierkens (3 out of 3 patents)

5. Albertus Franciscus Gerardus Van Driel (3 out of 3 patents)

6. Mark Hermans (3 out of 4 patents)

7. Michel Hendrikus Lambertus Teunissen (2 out of 3 patents)

8. Johannes Gerhardus Augustinus Zweers (2 out of 4 patents)

9. Jeroen Kleijburg (1 out of 1 patent)

10. Lambertus Franciscus Wilhelmus Van Haren (1 out of 1 patent)

11. Gerardus Hermanus Johannes Reulink (1 out of 1 patent)

12. Wilhelmus Johannes In Den Bosch (1 out of 1 patent)

13. Hendrikus Johannes Bernardus Peters (1 out of 4 patents)

14. Henricus Hermanus Johannes Van Londen (1 out of 1 patent)

15. Jan Roelofsen (1 out of 1 patent)

19 patents: Sort by Forward Citations

1. 12420465 - Method and mould for encapsulating electronic components mounted on a carrier (2025-09-23),

2. 12384081 - Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such (2025-08-12),

3. 11935764 - Sawing device and method for forming saw-cuts into a semiconductor product (2024-03-19),

4. 11887872 - Method and device for selectively separating electronic components from a frame with electronic components (2024-01-30),

5. 11842909 - Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators (2023-12-12),

6. 11554523 - Press part for supporting a mould part for encapsulating electronic components mounted on a carrier and a press comprising the press part (2023-01-17),

7. 11450550 - Handler device for handling substrates (2022-09-20),

8. 11217463 - Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators (2022-01-04),

9. 10913191 - Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product (2021-02-09),

10. 10720340 - Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components (2020-07-21),

11. 10699924 - Modular system for moulding electronic components and kit-of-parts for assembling such a modular system (2020-06-30),

12. 10217679 - Method for positioning a carrier with electronic components and electronic component produced with such method (2019-02-26),

13. 10032653 - Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components (2018-07-24),

14. 9831105 - Method for moulding and surface processing electronic components and electronic component produced with this method (2017-11-28),

15. 9644748 - Seal for a sawing machine for separating electronic components and sawing machine provided with such a seal (2017-05-09),

Company Overview

Besi Netherlands B.V. is a prominent player in the semiconductor industry, specializing in the development and manufacturing of advanced packaging equipment. The company focuses on innovative solutions that enhance the efficiency and performance of semiconductor devices. With a strong emphasis on research and technology, Besi operates within the realms of microelectronics and precision engineering, catering to a global market. Its headquarters in Duiven, Netherlands, positions it strategically within Europe's technology landscape.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

19 Patents

#2 in Duiven

#373 in Netherlands

#32,705 in the World

Duiven, Netherlands

Besi Netherlands B.v.

Forward Citations = 6

17 inventors:

Wilhelmus Gerardus Jozef Gal (4 out of 6 patents)

Johannes Lambertus Gerardus Maria Venrooij (4 out of 7 patents)

Jurgen Hendrikus Gerhardus Huisstede (4 out of 4 patents)

4. Henricus Antonius Maria Fierkens (3 out of 3 patents)

5. Albertus Franciscus Gerardus Van Driel (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Besi Netherlands B.v.. Retrieved from https://idiyas.com/company/besi-netherlands-b-v

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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