The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Jun. 26, 2018
Applicant:

Besi Netherlands B.v., Duiven, NL;

Assignee:

Besi Netherlands B.V., Duiven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); B29C 45/14 (2006.01); B29C 45/37 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); B29C 45/14655 (2013.01); B29C 45/37 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); B29C 2793/009 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The invention relates to a mould for encapsulating electronic components mounted on a carrier, with at least two mould parts which are displaceable relative to each other for engaging with a mould cavity round electronic components, and at least one feed for encapsulating material recessed into the mould parts and connecting to the mould cavity. The invention also relates to a carrier with encapsulated electronic components. The invention further relates to a method for encapsulating electronic components and to the thus manufactured encapsulated separated components.


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Teunissen, Michel Hendrikus Lambertus. (2020). Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components (U.S. Patent No. 10720340). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10720340

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