The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Dec. 10, 2015
Applicant:

Besi Netherlands B.v., Duiven, NL;

Assignee:

Besi Netherlands B.V., Duiven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/02 (2006.01); B29C 45/56 (2006.01); B29C 45/14 (2006.01); B29C 33/68 (2006.01); B29C 45/40 (2006.01);
U.S. Cl.
CPC ...
B29C 45/02 (2013.01); B29C 45/14655 (2013.01); B29C 45/56 (2013.01); B29C 33/68 (2013.01); B29C 45/40 (2013.01); B29C 2045/14163 (2013.01); B29C 2045/14663 (2013.01);
Abstract

A mould includes at least two mould parts, one of which includes a mould cavity for enclosing electronic components placed on a carrier and a contact surface for at least partially enclosing the mould cavity, contacting the carrier, and forming a tight connection with the carrier. A feed channel is recessed into the contact surface and the mould part further includes a displaceable barrier element that is displaceable in a direction substantially perpendicular to the contact surface connecting to the feed channel for regulating the size of a passage in the feed channel. A foil handler applies a foil layer between a wall of the feed channel and the displaceable barrier element which is configured for exerting a pressure onto the foil layer when the mould parts are moved apart to release the carrier with electronic components from the mould part.


Find Patent Forward Citations

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Venrooij, Johannes Lambertus Gerardus Maria. (2021). Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product (U.S. Patent No. 10913191). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10913191

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