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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10699924 B1

PDFFull Text
Date of Patent:
Jun. 30, 2020

Filed:

May. 10, 2016

Modular system for moulding electronic components and kit-of-parts for assembling such a modular system

Applicant:

Besi Netherlands B.v., Duiven, NL;

Inventors:

Johannes Lambertus Gerardus Maria Venrooij, Duiven, NL;

Jeroen Kleijburg, Elst, NL;

Assignee:

Besi Netherlands B.V., Duiven, NL;

Attorney:

The Webb Law Firm

Primary Examiner:

Nahida Sultana

Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/677 (2006.01); B29C 43/18 (2006.01); B29C 43/34 (2006.01); B29C 43/50 (2006.01); B29C 43/58 (2006.01); B29C 45/00 (2006.01); B29C 45/03 (2006.01); B29C 45/14 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6719 (2013.01); B29C 43/18 (2013.01); B29C 43/34 (2013.01); B29C 43/50 (2013.01); B29C 43/58 (2013.01); B29C 45/0084 (2013.01); H01L 21/67126 (2013.01); H01L 21/67772 (2013.01); H01L 21/67778 (2013.01); B29C 45/03 (2013.01); B29C 45/14655 (2013.01); B29C 2043/182 (2013.01); B29K 2063/00 (2013.01); B29L 2031/3406 (2013.01);
Abstract

The invention relates to a modular system for moulding electronic components, comprising at least three separate system modules; a press module for moulding the electronic components; a loader module for loading the electronic components to be moulded from a cassette to a press module; and a service module configured to at least partially control each of the other system modules. The invention also relates to a kit-of-parts for assembling such a modular system.

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Venrooij, Johannes Lambertus Gerardus Maria. (2020). Modular system for moulding electronic components and kit-of-parts for assembling such a modular system (U.S. Patent No. 10699924). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10699924

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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