logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9831105 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

Sep. 26, 2014

Method for moulding and surface processing electronic components and electronic component produced with this method

Applicant:

Besi Netherlands B.v., Duiven, NL;

Inventor:

Wilhelmus Gerardus Jozef Gal, Kilder, NL;

Assignee:

Besi Netherlands B.V., Duiven, NL;

Attorney:

The Webb Law Firm

Primary Examiner:

Evren Seven

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); B29C 45/14 (2006.01); B29C 33/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/566 (2013.01); B29C 45/14754 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3185 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); B29C 33/68 (2013.01); B29C 45/14655 (2013.01); B29C 2045/1477 (2013.01); B29C 2045/14663 (2013.01); H01L 2224/04105 (2013.01); H01L 2924/18162 (2013.01);
Abstract

The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed. The invention also relates to a partial encapsulated electronic component as produced with such a method.

Find Patent Forward Citations

Quick Actions:

Gal, Wilhelmus Gerardus Jozef. (2017). Method for moulding and surface processing electronic components and electronic component produced with this method (U.S. Patent No. 9831105). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9831105

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…