Jan Roelofsen

Title: Jan Roelofsen: Innovator in Electronic Component Encapsulation

Introduction

Jan Roelofsen is a notable inventor based in Zevenaar, Netherlands. He has made significant contributions to the field of electronic component encapsulation. His innovative approach has led to the development of a unique method that enhances the reliability and efficiency of electronic components.

Latest Patents

Jan Roelofsen holds a patent for a method and mould for encapsulating electronic components mounted on a carrier. The invention involves a systematic approach that includes placing the carrier with electronic components in a mould. It also introduces a liquid encapsulating material into the mould cavity. A key feature of this invention is the measurement of pressure on the upper side of a calibration component mounted on the carrier, utilizing a pressure sensor located in the contact surface of a mould part. This patent showcases his expertise in improving the encapsulation process for electronic components.

Career Highlights

Jan Roelofsen is associated with Besi Netherlands B.V., where he applies his innovative ideas to real-world applications. His work has contributed to advancements in the manufacturing processes of electronic components. His dedication to innovation is evident in his patent and the impact it has on the industry.

Collaborations

Jan has collaborated with notable colleagues, including Wilhelmus Gerardus Joseph Gal and Johannes Lambertus Gerardus Maria Venrooij. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Jan Roelofsen is a distinguished inventor whose work in encapsulating electronic components has made a significant impact on the industry. His innovative methods and collaborations continue to drive advancements in technology.