Besi Netherlands B.v.

Jan Roelofsen

Johannes Lambertus Gerardus Maria Venrooij

Wilhelmus Gerardus Joseph Gal

The invention relates to a method for encapsulating electronic components mounted on a carrier, including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. The invention also relates to a mould for encapsulating electronic components mounted on a carrier with such a method.

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Zevenaar, Netherlands

Jan Roelofsen