The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jun. 08, 2021
Applicant:

Besi Netherlands B.v., Duiven, NL;

Assignee:

Besi Netherlands B.V., Duiven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/02 (2006.01); B29C 45/14 (2006.01); B29C 45/40 (2006.01); B29C 45/76 (2006.01); B29C 45/77 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14655 (2013.01); B29C 45/02 (2013.01); B29C 45/14008 (2013.01); B29C 45/40 (2013.01); B29C 45/7653 (2013.01); B29C 45/77 (2013.01); H01L 21/566 (2013.01);
Abstract

The invention relates to a method for encapsulating electronic components mounted on a carrier, including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. The invention also relates to a mould for encapsulating electronic components mounted on a carrier with such a method.


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