The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Apr. 06, 2011
Tadahiro Ishizaka, Yamanashi, JP;
Atsushi Gomi, Yamanashi, JP;
Takara Kato, Yamanashi, JP;
Osamu Yokoyama, Yamanashi, JP;
Takashi Sakuma, Yamanashi, JP;
Chiaki Yasumuro, Yamanashi, JP;
Hiroyuki Toshima, Yamanashi, JP;
Tatsuo Hatano, Yamanashi, JP;
Yasushi Mizusawa, Yamanashi, JP;
Masamichi Hara, Yamanashi, JP;
Tadahiro Ishizaka, Yamanashi, JP;
Atsushi Gomi, Yamanashi, JP;
Takara Kato, Yamanashi, JP;
Osamu Yokoyama, Yamanashi, JP;
Takashi Sakuma, Yamanashi, JP;
Chiaki Yasumuro, Yamanashi, JP;
Hiroyuki Toshima, Yamanashi, JP;
Tatsuo Hatano, Yamanashi, JP;
Yasushi Mizusawa, Yamanashi, JP;
Masamichi Hara, Yamanashi, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method of forming a Cu wiring in a trench or hole formed in a substrate is provided. The method includes forming a barrier film on the surface of the trench or hole, forming a Ru film on the barrier film, and embedding copper in the trench or hole by forming a Cu film on the Ru film using PVD while heating the substrate such that migration of copper into the trench or hole occurs.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile