The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Nov. 17, 2005
Chia Yong Poo, Singapore, SG;
Boon Suan Jeung, Singapore, SG;
Low Siu Waf, Singapore, SG;
Chan Min Yu, Singapore, SG;
Neo Yong Loo, Singapore, SG;
Eng Meow Koon, Singapore, SG;
Ser Bok Leng, Singapore, SG;
Chua Swee Kwang, Singapore, SG;
SO Chee Chung, Singapore, SG;
Ho Kwok Seng, Singapore, SG;
Chia Yong Poo, Singapore, SG;
Boon Suan Jeung, Singapore, SG;
Low Siu Waf, Singapore, SG;
Chan Min Yu, Singapore, SG;
Neo Yong Loo, Singapore, SG;
Eng Meow Koon, Singapore, SG;
Ser Bok Leng, Singapore, SG;
Chua Swee Kwang, Singapore, SG;
So Chee Chung, Singapore, SG;
Ho Kwok Seng, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.