Location History:
- Signapore, SG (2012)
- Singpore, SG (2019)
- Singapore, SG (2003 - 2020)
Company Filing History:
33 out of 38,002 
2 out of 428 Years Active: 2003-2020
Title: Low Siu Waf – Innovator in Circuit Packaging Solutions
Introduction
Low Siu Waf is a prominent inventor based in Singapore, recognized for his significant contributions to the field of integrated circuit packaging. With a remarkable total of 35 patents to his name, he has established himself as a leading innovator in this technical domain.
Latest Patents
Among his latest innovations, Low Siu Waf has developed a method for packaging integrated circuit chips (die). This method involves several critical steps, including providing a base substrate with package level contacts, coating the substrate with adhesive, and placing chips on the adhesive. The process also includes electrically connecting the die to the package level contacts and removing the backside of the substrate to reveal the package level contacts. This innovation leads to the formation of an essentially true chip scale package. Further advancements include creating multi-chip modules by filling the gaps between chips with an encapsulant. In some embodiments, chips are interconnected through electrical connections in the base substrate, and substrates with chips can be adhered back-to-back with through vias to facilitate interconnections.
Career Highlights
Throughout his career, Low Siu Waf has worked at notable companies, including Micron Technology Incorporated and Round Rock Research, LLC. His roles in these organizations have allowed him to apply his innovative ideas to real-world applications, significantly impacting the electronics industry.
Collaborations
Low Siu Waf has had the opportunity to collaborate with talented individuals in his field, including Chia Yong Poo and Boon Suan Jeung. These partnerships have spurred creativity and fostered advancements in circuit packaging solutions.
Conclusion
Low Siu Waf's innovative methods in packaging integrated circuits have undoubtedly advanced technology in this area. With an impressive collection of patents and collaborative efforts, he continues to inspire and shape the future of circuit design and packaging.