The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2012
Filed:
Feb. 12, 2010
Chia Yong Poo, Singapore, SG;
Boon Suan Jeung, Singapore, SG;
Low Siu Waf, Signapore, SG;
Chan Min Yu, Singapore, SG;
Neo Yong Lou, Singapore, SG;
Eng Meow Koon, Singapore, SG;
Ser Bok Leng, Singapore, SG;
Chun Swee Kwang, Singapore, SG;
SO Chee Chung, Singapore, SG;
Ho Kwok Song, Singapore, SG;
Chia Yong Poo, Singapore, SG;
Boon Suan Jeung, Singapore, SG;
Low Siu Waf, Signapore, SG;
Chan Min Yu, Singapore, SG;
Neo Yong Lou, Singapore, SG;
Eng Meow Koon, Singapore, SG;
Ser Bok Leng, Singapore, SG;
Chun Swee Kwang, Singapore, SG;
So Chee Chung, Singapore, SG;
Ho Kwok Song, Singapore, SG;
Round Rock Research, LLC, Mt. Kisco, NY (US);
Abstract
An apparatus comprises an integrated circuit die including a main body having a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer. The integrated circuit die also includes a bond pad on the main body, an edge contact at the peripheral edge surface and a line connecting the bond pad to the edge contact. The edge contact includes a bottom surface that substantially in the same plane as a surface of an encapsulant encasing the die. Additional apparatus, systems, and methods are disclosed.