Singapore, Singapore

So Chee Chung


Average Co-Inventor Count = 10.0

ph-index = 4

Forward Citations = 81(Granted Patents)


Company Filing History:


Years Active: 2005-2012

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5 patents (USPTO):Explore Patents

Title: So Chee Chung: Innovator in Circuit Packaging Technology

Introduction

So Chee Chung is a notable inventor based in Singapore, recognized for his contributions to circuit packaging technology. He holds a total of 5 patents that showcase his innovative approaches in the field. His work has significantly impacted the way integrated circuits are designed and packaged.

Latest Patents

Among his latest patents is an apparatus and method for packaging circuits. This invention describes methods for forming edge contacts on a die without increasing its height. The edge contacts are strategically positioned on the periphery of the die and within the saw streets. Each edge contact connects to a bond pad of adjacent dies, allowing for efficient separation during the manufacturing process. Additionally, a recess is formed in the saw street, which is created by scribing with a mechanical cutter. This recess is then patterned, and contact material is deposited to establish the edge contacts. Another patent details an apparatus that includes an integrated circuit die with a main body, bond pad, and edge contact, ensuring that the edge contact's bottom surface aligns with the encapsulant surface encasing the die.

Career Highlights

So Chee Chung has worked with prominent companies in the technology sector, including Micron Technology Incorporated and Round Rock Research, LLC. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in circuit packaging.

Collaborations

Throughout his career, So Chee Chung has collaborated with talented individuals such as Chia Yong Poo and Boon Suan Jeung. These partnerships have fostered innovation and led to the development of cutting-edge technologies in the field.

Conclusion

So Chee Chung's work in circuit packaging technology exemplifies his innovative spirit and dedication to advancing the industry. His patents reflect a deep understanding of the complexities involved in integrated circuit design, making him a valuable contributor to the field.

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