Micron Technology Incorporated

Round Rock Research, LLC

So Chee Chung

Chia Yong Poo

Boon Suan Jeung

Eng Meow Koon

Chan Min Yu

Ser Bok Leng

Low Siu Waf

Chua Swee Kwang

Neo Yong Loo

Ho Kwok Seng

Neo Yong Lou

Chun Swee Kwang

Ho Kwok Song

Hu Kwok Seng

Low Slu Waf

Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.

Apparatus and method for packaging circuits

An apparatus comprises an integrated circuit die including a main body having a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer. The integrated circuit die also includes a bond pad on the main body, an edge contact at the peripheral edge surface and a line connecting the bond pad to the edge contact. The edge contact includes a bottom surface that substantially in the same plane as a surface of an encapsulant encasing the die. Additional apparatus, systems, and methods are disclosed.

Method for fabricating packaged die

Growing community of inventors

Singapore, Singapore

So Chee Chung