This inventor holds 1 USPTO granted patent. Top assignee: Round Rock Research, LLC. Active years: 2012.
Company Filing History:
Years Active: 2012
Title: Innovations by Chun Swee Kwang
Introduction
Chun Swee Kwang is a notable inventor based in Singapore, SG. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of circuit packaging.
Latest Patents
Chun Swee Kwang holds a patent for an "Apparatus and method for packaging circuits." This apparatus comprises an integrated circuit die that includes a main body with a top layer, a bottom layer, and a peripheral edge surface extending between the two layers. The integrated circuit die features a bond pad on the main body, an edge contact at the peripheral edge surface, and a line connecting the bond pad to the edge contact. Notably, the edge contact includes a bottom surface that is substantially in the same plane as a surface of an encapsulant encasing the die. Additional apparatus, systems, and methods are disclosed in his patent.
Career Highlights
Chun Swee Kwang is currently associated with Round Rock Research, LLC, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the field of circuit packaging.
Collaborations
Chun has collaborated with talented individuals such as Chan Min Yu and Ho Kwok Song, contributing to a dynamic work environment that fosters innovation.
Conclusion
Chun Swee Kwang's contributions to the field of integrated circuit packaging exemplify the spirit of innovation. His patent reflects a significant advancement in technology, showcasing his expertise and dedication to improving circuit design.