Round Rock Research, LLC

Chun Swee Kwang

Chia Yong Poo

Low Siu Waf

Boon Suan Jeung

Eng Meow Koon

Chan Min Yu

Ser Bok Leng

So Chee Chung

Neo Yong Lou

Ho Kwok Song

An apparatus comprises an integrated circuit die including a main body having a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer. The integrated circuit die also includes a bond pad on the main body, an edge contact at the peripheral edge surface and a line connecting the bond pad to the edge contact. The edge contact includes a bottom surface that substantially in the same plane as a surface of an encapsulant encasing the die. Additional apparatus, systems, and methods are disclosed.

Apparatus and method for packaging circuits

Growing community of inventors

Singapore, Singapore

Chun Swee Kwang