Company Filing History:
26 out of 38,002 
2 out of 428 Years Active: 2003-2020
Title: Eng Meow Koon: Innovator in Circuit Packaging Technology
Introduction
Eng Meow Koon, an accomplished inventor based in Singapore, has made significant contributions to the field of circuit packaging technology. With an impressive portfolio of 28 patents, he has established himself as a notable figure in the electronics industry, particularly in the design and manufacturing of integrated circuit packaging.
Latest Patents
Among his latest inventions is a novel method for packaging integrated circuit chips. This method involves several key steps: providing a base substrate with package level contacts, applying adhesive to the substrate, placing dies onto the adhesive, and electrically connecting the dies to the package level contacts. The backside of the base substrate is then removed to expose the backside of the package level contacts, resulting in the formation of an essentially true chip scale package. Additionally, multi-chip modules can be created by filling the gaps between the chips with an encapsulant. The technology further allows for interconnecting chips via electrical connections between package level contacts in the base substrate, and in some configurations, substrates with chips can be adhered back-to-back with through vias arranged in aligned saw streets for interconnection.
Career Highlights
Eng Meow Koon has worked with notable companies that include Micron Technology Incorporated and Round Rock Research, LLC. His expertise in circuit packaging has led to advancements in the field, paving the way for new technologies that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Eng has collaborated with skilled professionals, including Chia Yong Poo and Low Siu Waf. These partnerships have contributed to the innovative processes he has developed, fostering a collaborative environment in advancing technology.
Conclusion
Eng Meow Koon remains a pivotal figure in the realm of circuit packaging innovation. His dedication to improving the functionality and efficiency of integrated circuits through his patents not only reflects his expertise but also his commitment to pushing the boundaries of technology in the electronics industry. His work continues to inspire future inventors and engineers to explore new possibilities in this dynamic field.