Chia Yong Poo

This inventor holds 41 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Round Rock Research, LLC. Active years: 2003-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia Yong Poo. Retrieved from https://idiyas.com/inventor/chia-yong-poo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 41

% Patents Active = 73.2

Average Co-Inventor Count = 4.3

ph-index = 18

Forward Citations = 1,228(Granted Patents)

Company Filing History:

39 out of 39,176

Micron Technology Incorporated

patents

2 out of 428

Round Rock Research, LLC

patents

Years Active: 2003-2020

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Areas of Expertise:

Semiconductor Packaging

Microelectronic Components

Leadless Packaging

Wafer Level Packaging

Stacked Packages

Interconnects

Discrete Components

Leadframe Grid Arrays

Integrated Circuit Chips

Manufacturing Methods

Bond Pads

Multi-Substrate Packages

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10811278 - Method for packaging circuits (2020-10-20),

2. 10453704 - Method for packaging circuits (2019-10-22),

3. 9484225 - Method for packaging circuits (2016-11-01),

4. 8637973 - Packaged microelectronic components with terminals exposed through encapsulant (2014-01-28),

5. 8629054 - Packaged semiconductor assemblies and methods for manufacturing such assemblies (2014-01-14),

6. 8174105 - Stacked semiconductor package having discrete components (2012-05-08),

7. 8168476 - Interconnects for packaged semiconductor devices and methods for manufacturing such devices (2012-05-01),

8. 8138617 - Apparatus and method for packaging circuits (2012-03-20),

9. 8115306 - Apparatus and method for packaging circuits (2012-02-14),

10. 8008126 - Castellation wafer level packaging of integrated circuit chips (2011-08-30),

11. 7964946 - Semiconductor package having discrete components and system containing the package (2011-06-21),

12. 7947529 - Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods (2011-05-24),

13. 7807502 - Method for fabricating semiconductor packages with discrete components (2010-10-05),

14. 7781877 - Packaged integrated circuit devices with through-body conductive vias, and methods of making same (2010-08-24),

15. 7723831 - Semiconductor package having die with recess and discrete component embedded within the recess (2010-05-25),

Title: Innovations and Contributions of Chia Yong Poo in Circuit Packaging Technology

Introduction

Chia Yong Poo is a prominent inventor based in Singapore, known for his remarkable contributions to the field of integrated circuit packaging. With a remarkable portfolio of 41 patents to his name, he has significantly influenced modern electronic design and manufacturing processes.

Latest Patents

One of Chia's latest inventions is a method for packaging integrated circuit chips. This innovative method involves providing a base substrate with package level contacts, coating it with adhesive, and placing the dies onto the adhesive. This process includes electrically connecting the die to the package level contacts and ultimately removing the backside of the base substrate to expose these contacts. The result is an essentially true chip scale package, enhancing the efficiency of multi-chip modules by filling gaps with encapsulants. His designs feature interconnections between chips through electrical connections in the base substrate, as well as configurations for adhering substrates back-to-back using through vias.

Career Highlights

Chia Yong Poo has made significant strides in his career, notably through his work at respected organizations such as Micron Technology Incorporated and Round Rock Research, LLC. His experiences in these companies have allowed him to hone his skills and expand his contributions to the field of electronic packaging.

Collaborations

Throughout his career, Chia has collaborated with notable individuals such as Low Siu Waf and Boon Suan Jeung. These partnerships have been instrumental in furthering his research and consolidating his innovations in circuit packaging technologies.

Conclusion

Chia Yong Poo stands as a notable figure in the advancement of integrated circuit packaging. His 41 patents underscore his commitment to innovation and his ability to deliver impactful solutions in electronics. As technology continues to evolve, his contributions will undeniably shape the future of circuit design and manufacturing.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]