Company Filing History:
39 out of 38,002 
2 out of 428 Years Active: 2003-2020
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Title: Innovations and Contributions of Chia Yong Poo in Circuit Packaging Technology
Introduction
Chia Yong Poo is a prominent inventor based in Singapore, known for his remarkable contributions to the field of integrated circuit packaging. With a remarkable portfolio of 41 patents to his name, he has significantly influenced modern electronic design and manufacturing processes.
Latest Patents
One of Chia's latest inventions is a method for packaging integrated circuit chips. This innovative method involves providing a base substrate with package level contacts, coating it with adhesive, and placing the dies onto the adhesive. This process includes electrically connecting the die to the package level contacts and ultimately removing the backside of the base substrate to expose these contacts. The result is an essentially true chip scale package, enhancing the efficiency of multi-chip modules by filling gaps with encapsulants. His designs feature interconnections between chips through electrical connections in the base substrate, as well as configurations for adhering substrates back-to-back using through vias.
Career Highlights
Chia Yong Poo has made significant strides in his career, notably through his work at respected organizations such as Micron Technology Incorporated and Round Rock Research, LLC. His experiences in these companies have allowed him to hone his skills and expand his contributions to the field of electronic packaging.
Collaborations
Throughout his career, Chia has collaborated with notable individuals such as Low Siu Waf and Boon Suan Jeung. These partnerships have been instrumental in furthering his research and consolidating his innovations in circuit packaging technologies.
Conclusion
Chia Yong Poo stands as a notable figure in the advancement of integrated circuit packaging. His 41 patents underscore his commitment to innovation and his ability to deliver impactful solutions in electronics. As technology continues to evolve, his contributions will undeniably shape the future of circuit design and manufacturing.